Besi shares fall on report ASML is working on rival hybrid bonding product
Dutch semiconductor equipment giant ASML is expanding into next-generation hybrid bonding, a technique that creates dense electrical connections by directly joining chips or silicon wafers, according to a new report. Major Chinese companies are also adopting the technology to improve chip…
Open on the live globe →Who reported it
- 2026-10-16 10:51 UTCCNA · channelnewsasia.com ↗
- 2026-10-16 12:30 UTCSCMP · scmp.com ↗
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